• ISO 13485 certificated
• Bio sensor OEM service
• Provide bio / medical semi-conductor packaging and testing service
• Antibody/ Antigen coating service. ( Automation production line)

Bio Module Structure

We can support from SMT to semiconduct Multi-Chip include GaAs, GaN and silicon IC.
OEM assmebly for SiP (System in package) and MCM(Multi-Chip module).

SiP molding assembly

• Wi-Fi Module: ASIC x 2(Chip wires), MMICx3, componentsx20~40pcs(SMT), Au ball bondings, Liquid Molding and Dicing

GaAs MMICs Assembly

• MMICs assembly for HPA, LNA, SPDT and LIMITER: MMIC x 4(ribbon and wedge wires), capacitors x 10, Ceramic lid with Au/Sn seal
• MMIC x 1(ribbon wires), capacitors x 5, Ceramic cap with Au/Sn seal

GaN chip Assembly

• GaN x 2(Gold wires), capacitors x 2, Alumina substrate x 2, Ceramic cap with epoxy seal (Metal Lid)
• GaN HEMT Package
• GaAs FET Package
• Good loop height control for RF device

SiP Module Structure

OEM Service for Air cavity and molding types. The material includes Ceramic、PCB and Pre-mold type etc.

MEMS module OEM service. Reference : Gyroscope, G-sensor, AR/VR and thermal imaging related products.

MEMS reference (G-sensor MEMS)

• G-sensor MEMS: G-cell x 1, IC x1, Gold ball bonding, Stack die & bonding
• Special DCT for G-cell Die Attachment
• Stack IC die on G-cell

MEMS reference (Gyroscope MEMS)

• Gyroscope MEMS: Gyroscope Mems x 1, ASIC IC x1, Gold ball bonding, Stack die & B-stage
• Stack Mems die on ASIC IC
• Gold ball bonding

COB Module OEM service. 

For example : The Camera Module. Mainly for Resolution 2.3 M pixel.

• Interior camera for automotive: Interior camera uses AI to detect driver distraction and fatigue.

Camera Module Structure